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Products / Thermal Interface Materials / Gap Filler Pads / Sheets / Low Density Silicone Thermal Interface Pad, 1.5W/m.K

Low Density Silicone Thermal Interface Pad, 1.5W/m.K

GCS
GCSP-15LD
Features
Specifications
Thermal conductivity W/m.K 1.5
Hardness 40
Thickness mm 0.3-5.0
Single / Double side adhesive Single
Request information Data sheet