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Used to cool or
heat objects directly attached to cold plates or enclosures
by attaching a thermally conductive container to the cold
plate.
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Features: |
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High
cooling effect for size |
| Capable
of reaching very low temperatures |
| Ideal
when heat removal not near object |
| Compact
designs |
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| Typical
applications: |
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Testplate
for electronic components |
| Cooling
high power lasers |
| Cooling
analytical instruments |
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Graph |
Part Number
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Current (A)
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Power
Input (W)
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Max
Temp (°C)
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| 1 |
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3.9
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47
|
70
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| 2 |
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3.1
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37
|
69
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| 3 |
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3.9
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94
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69
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| 4 |
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5.4
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65
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69
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| 5 |
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3.1
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74
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69
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| 6 |
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5.3
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127
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68
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| 7 |
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6.2
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149
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69
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| 8 |
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10.6
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254
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68
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| 9 |
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14.2
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341
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67
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