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Thermoelectric Products

Liquid to Air Assemblies  
   

 

 

 
 

Used to cool or heat a liquid flowing through a heatsink. Heat is dissipated via the air side heatsink and the liquid kept cool. Designed to offer compact and reliable cooling.

 
 
Features:  
  Compact design  
  Efficient liquid heat sink  
  Temperature controllers can be integrated  
  High reliability, minimum maintenance  
   
Typical applications:  
  Testplate for electronic components  
  Cooling high power lasers
  Cooling analytical instruments
   
 
   
 
 
Graph
Part Number
Current (A)
Power Input (W)
Max Temp (°C)
1
1.6
40
49
2
2.8
34
49
3
3.7
89
53
4
3.1
74
54
5
5.7
2.9
69
70
53
53
6
7.2
173
51
7
5.2
125
44
8
6.2
149
48

 
   
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