Products / Thermal Interface Materials / Gap Filler Pads / Sheets / Low Density Silicone Thermal Interface Pad, 2.0W/m.K
Low Density Silicone Thermal Interface Pad, 2.0W/m.K
GCSP-20LD
Features
- Low density, ideal for weight limited applications< /li>
- 2.0 W/m K thermal conductivity
With single side adhesive
- Long term stability
- >10 kV breakdown voltage
- ROHS/REACH compliant
Specifications
| Thermal conductivity W/m.K |
2 |
| Hardness |
50 |
| Thickness mm |
0.3-5.0 |
| Single / Double side adhesive |
Single |
Request information Data sheet
