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Ceramic heat sinks launched


A new range of ceramic heat sinks have been launched under the company's Spreadfast brand. The company has designed these primarily for chip based cooling applications but also to allow volume access to ceramic based products at low cost.

The ceramic heat sink provides both excellent thermal conductivity whilst giving high electrical resistance allowing the sink to be used as an assembly plate for either printed electronics or direct attachment of power components. Products are readily available from Farnell Components, and we can engineer new solutions as needed. Please contact for more details.